Faculty
Joo-Youl Huh (Joo-Youl Huh)
- Position
- Professor
- Phone Number
- 02-3290-3278
- Research Areas
- Phase field Simulations of the Microstructural evolution, Development of Fe-Cr-based Alloys as Metallic Interconnect for Solid Oxide Fuel Cells, Solder Joint Reliability of the Electronic Packaging using Pb-free Solder
- Office
- #621, Engineering Building
- Degree
- Professor
- jyhuh@korea.ac.kr
Education
-
1986.9 ~ 1993.4 : Ph.D. Material Science and Engineering, Carnegie Mellon Univ. USA 1987.3 ~ 1985.2 : M.S. Metallurgical Engineering, Seoul National University 1979.3 ~ 1983.2 : B.S. Metallurgical Engineering, Seoul National University
Professional Experience and Awards
-
1999.3 ~ Present : Korea University, Associate Professor 1996.7 ~ 1996.8 : Max Planck Institute for Microstructure Physics. Visiting Scholar 1996.3 ~ 1999.2 : Korea University, Assistant Professor 1995.3 ~ 1996.1 : Korea Institute of Science and Technology, Senior Researcher 1993.9 ~ 1995.2 : Max Planck Institute for Microstructure Physics. Post-Doctoral Fellow
Journal Articles
-
1. S.T. Kim and J.Y. Huh, "Enhanced Growth Kinetics of Intermetallic Compounds between Bi-containing Sn-3.5Ag Solders and Cu Substrate during Aging", Materials Science Forum, 475-479 2627-2630 (2005). 2. H.S. Lee, B. Cheong, T.S. Lee, K.S. Lee, W.M. Kim, and J.Y. Huh, "A Semiconducting Thermo-optic Material for Potential Application to Super-resolution optical Data Storage", Thin Solid Films, in press (2005). 3. J.Y. Huh, K.K. Hong, Y.B. Kim, and K.T. Kim, "Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions", J. Electron. Mater, 33(10), 1161-1169 (2004). 4. H.S. Lee, B. Cheong, T.S. Lee, K.S. Lee, W.M. Kim, J.W. Lee, S.H. Cho, and J.Y. Huh, "Thermoelectric PbTe Thin Film for Super-resolution Optical Data Storage", Appl. Phys. Lett., 84(14), 2782-2784 (2004). 5. J.Y. Huh, S.U. Han, and C.Y. Park, "Effect of Bismuth on the Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints: A Growth Kinetic Model", Metals and Materials International, 10, 123-131 (2004). 6. W.C. Johnson and J.Y. Huh, "Thermodynamics of Stress-induced Interstitial Redistribution in BCC Metals", Metall. Mater. Trans. A, 34A, 2819-2825 (2003) 7. M.D. Chun, D. Kim, and J.Y. Huh, "Radiation-induced junction formation behavior of boron-doped Czochralski and float zone silicon crystals under 3 MeV proton irradiation", J. Appl. Phys. 94(9), 5617-5622 (2003). 8. W.C. Johnson, S.M. Wise, J.Y. Huh, J. Favergeon, "Effect of interfacial segregation on phase decomposition of a thin film on a patterned substrate", Metals and Materials, 9, 1-8 (2003). 9.C.K. Shin, Y.-J. Baik, and J.Y. Huh, "Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints", J. Electron. Mater., 30(5), 1323-1331 (2001). 10. J.Y. Huh and S.J. Moon, "Effect of elastic stresses on solid-state amorphization of Zr/Co multilayers", Thin Solid Films, 377-378, 611-616 (2000)